Technology innovations 25c-1: High-resolution chemical composition analysis for advanced process - EELS analysis
2025.3.26
技術情報
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Feedbacks from key clients in US and Europe
2025.10.9
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We have been receiving quality professional services on semiconductor materials analysis, including ...
TEM analysis on Samsung 5 nm technology node
2018.4.17
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TEM with high spacial resolution has been widely utilized to analyze advanced chips. The sample is S...
Materials and surface analyses on Samsung image sensor
2018.4.17
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Materials and surface analyses are utilized to unveil inner structures of the Samsung image sensor. ...
Analysis on Qualcomm 5G mmWAVE AiP
2018.4.17
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OM image of Qualcomm 5G mmWAVE AiP, QT525 AiP purchased from the market is shown in a. After removin...
Materials analysis on SiC MOSFET
2024.10.9
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It has been proved that SiC MOSFET has much greater efficiency compared to Si version, especially at...
PFIB analysis on quartz device
2024.10.9
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Quartz device is a common component in all electronic products from EV, 5G, IoT, aerospace, and AI. ...
MSS niche analysis on substrates: PFIB and advanced imaging method
2024.10.9
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Preparing cross-sectional substrates by Ga FIBs is time-consuming due to their lateral size. ...
Low-temperature ALD application for photoresists
2024.10.9
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Photoresist (PR), a commonly used materials in IC lithography, is extremely sensitive to temperature...
Materials analysis on VCSEL
2024.10.9
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Materials analysis on a VCSEL (Vertical-cavity surface-emitting laser) chip, purchased from the mark...
Materials analysis on 3D V-NAND
2024.10.9
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NAND flash memory, a type of non-volatile storage memory, can be found everywhere in our daily life,...